光刻机被认为是芯片制造过程中最为重要的设备,其能够将设计好的电路刻制在微小的晶圆上。“光刻“的流程如图所示,先在晶圆硅片表面覆盖一层对光敏感的光刻胶,再用光线透过掩模版
![](https://math.21cnjy.com/MathMLToImage?mml=%3Cmath+xmlns%3D%22http%3A%2F%2Fwww.w3.org%2F1998%2FMath%2FMathML%22%3E%3Cmo+stretchy%3D%22false%22%3E%28%3C%2Fmo%3E%3C%2Fmath%3E)
其上有设计好的电路图
![](https://math.21cnjy.com/MathMLToImage?mml=%3Cmath+xmlns%3D%22http%3A%2F%2Fwww.w3.org%2F1998%2FMath%2FMathML%22%3E%3Cmo+stretchy%3D%22false%22%3E%29%3C%2Fmo%3E%3C%2Fmath%3E)
、光学镜片最终照射在硅片表面,被光线照射到的光刻胶会发生反应,随后用特定溶剂洗去被照射
![](https://math.21cnjy.com/MathMLToImage?mml=%3Cmath+xmlns%3D%22http%3A%2F%2Fwww.w3.org%2F1998%2FMath%2FMathML%22%3E%3Cmo+stretchy%3D%22false%22%3E%28%3C%2Fmo%3E%3C%2Fmath%3E)
或未被照射
![](https://math.21cnjy.com/MathMLToImage?mml=%3Cmath+xmlns%3D%22http%3A%2F%2Fwww.w3.org%2F1998%2FMath%2FMathML%22%3E%3Cmo+stretchy%3D%22false%22%3E%29%3C%2Fmo%3E%3C%2Fmath%3E)
的光刻胶,就实现电路图从掩模版到硅片的转移。光源是光刻机的核心部件之一,光刻机的工艺能力首先取决于光源的波长,其决定了芯片的制程。早期光刻机的光源是采用汞灯产生的紫外光源,波长约
![](https://math.21cnjy.com/MathMLToImage?mml=%3Cmath+xmlns%3D%22http%3A%2F%2Fwww.w3.org%2F1998%2FMath%2FMathML%22%3E%3Cmrow%3E%3Cmn%3E365%3C%2Fmn%3E%3Cmi%3En%3C%2Fmi%3E%3Cmi%3Em%3C%2Fmi%3E%3C%2Fmrow%3E%3C%2Fmath%3E)
, 随后业界采用了准分子激光的深紫外光源,将波长进一步缩小到
![](https://math.21cnjy.com/MathMLToImage?mml=%3Cmath+xmlns%3D%22http%3A%2F%2Fwww.w3.org%2F1998%2FMath%2FMathML%22%3E%3Cmrow%3E%3Cmn%3E193%3C%2Fmn%3E%3Cmi%3En%3C%2Fmi%3E%3Cmi%3Em%3C%2Fmi%3E%3C%2Fmrow%3E%3C%2Fmath%3E)
, 目前开始采用极紫外光源来进一步提供更短波长的光。
![](http://tikupic.21cnjy.com/2023/05/22/bd/14/bd14b229f64099ad9931875db7632c0e_222x246.png)